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Die Sorter Product List

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Semi-Automatic Die Sorter "System DE35-ST"

Ideal for small-batch, multi-variety production! Equipment with excellent operability that does not require operator skills.

The "System DE35-ST" is a semi-automatic die sorter that is versatile, primarily designed for tray packing of good chips, chip appearance inspection, epoxy die bonding, flip chip, and front and back inspection (optional specifications). It is well-suited for prototype lines and small-batch, diverse production, and can accommodate various chip sizes through tool changes. 【Features】 ■ Suitable for small-batch, diverse production ■ Can accommodate various chip sizes through tool changes ■ Excellent operability that does not require operator skills ■ No need for readjustment during the next operation after turning off the power switch at the end of work ■ The movement of the output stage is automatically determined by simply entering the used tray number *For more details, please refer to the external link or feel free to contact us.

  • Semiconductor inspection/test equipment
  • Die Sorter

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WLCSP die sorter "ADAT3 XF DS"

Processing capacity of 60,000 units per hour. Contributes to quality assurance and productivity improvement by performing six-sided inspections of dies without reducing speed.

The die sorter "ADAT3 XF DS" for wafer-level CSP and micro CSP has a processing capacity of 60,000 units per hour and accommodates die sizes from 0.2×0.4mm to 5×5mm. It features the ability to automatically inspect all six sides of the die without reducing processing speed, contributing to quality control and cost reduction in subsequent processes. It supports automation in semiconductor manufacturing with programmable low-pressure pick force and automatic wafer exchange capabilities. 【Features】 - Achieves both a processing speed of 60,000 units per hour and automatic inspection of all six sides - Accommodates die sizes from 0.2×0.4mm to 5×5mm - Contributes to automation with support for 8 to 12-inch wafers and automatic exchange functionality *For more details, please download the PDF or feel free to contact us.

  • Bonding Equipment
  • Die Sorter

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